Technology Reports of Kansai University

Technology Reports of Kansai University (ISSN: 04532198) is a monthly peer-reviewed and open-access international Journal. It was first built in 1959 and officially in 1975 till now by kansai university, japan. The journal covers all sort of engineering topic, mathematics and physics. Technology Reports of Kansai University (TRKU) was closed access journal until 2017. After that TRKU became open access journal. TRKU is a scopus indexed journal and directly run by faculty of engineering, kansai university.

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Submission Deadline

Volume - 64 , Issue 06
20 Dec 2022
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Upcoming Publication

Volume - 64 , Issue 06
30 Nov 2022

Aim and Scope

Technology Reports of Kansai University (ISSN: 04532198) is a peer-reviewed journal. The journal covers all sort of engineering topic as well as mathematics and physics. the journal's scopes are in the following fields but not limited to: Zhonghua er bi yan hou tou jing wai ke za zhi = Chinese journal of otorhinolaryngology head and neck surgery Interventional Pulmonology

Electrical Engineering and Telecommunication Section:

Electrical Engineering, Telecommunication Engineering, Electro-mechanical System Engineering, Biological Biosystem Engineering, Integrated Engineering, Electronic Engineering, Hardware-software co-design and interfacing, Semiconductor chip, Peripheral equipments, Nanotechnology, Advanced control theories and applications, Machine design and optimization , Turbines micro-turbines, FACTS devices , Insulation systems , Power quality , High voltage engineering, Electrical actuators , Energy optimization , Electric drives , Electrical machines, HVDC transmission, Power electronics.

Computer Science Section :

Software Engineering, Data Security , Computer Vision , Image Processing, Cryptography, Computer Networking, Database system and Management, Data mining, Big Data, Robotics , Parallel and distributed processing , Artificial Intelligence , Natural language processing , Neural Networking, Distributed Systems , Fuzzy logic, Advance programming, Machine learning, Internet & the Web, Information Technology , Computer architecture, Virtual vision and virtual simulations, Operating systems, Cryptosystems and data compression, Security and privacy, Algorithms, Sensors and ad-hoc networks, Graph theory, Pattern/image recognition, Neural networks.

Civil and architectural engineering :

Architectural Drawing, Architectural Style, Architectural Theory, Biomechanics, Building Materials, Coastal Engineering, Construction Engineering, Control Engineering, Earthquake Engineering, Environmental Engineering, Geotechnical Engineering, Materials Engineering, Municipal Or Urban Engineering, Organic Architecture, Sociology of Architecture, Structural Engineering, Surveying, Transportation Engineering.

Mechanical and Materials Engineering :

kinematics and dynamics of rigid bodies, theory of machines and mechanisms, vibration and balancing of machine parts, stability of mechanical systems, mechanics of continuum, strength of materials, fatigue of materials, hydromechanics, aerodynamics, thermodynamics, heat transfer, thermo fluids, nanofluids, energy systems, renewable and alternative energy, engine, fuels, nanomaterial, material synthesis and characterization, principles of the micro-macro transition, elastic behavior, plastic behavior, high-temperature creep, fatigue, fracture, metals, polymers, ceramics, intermetallics.

Chemical Engineering :

Chemical engineering fundamentals, Physical, Theoretical and Computational Chemistry, Chemical engineering educational challenges and development, Chemical reaction engineering, Chemical engineering equipment design and process design, Thermodynamics, Catalysis & reaction engineering, Particulate systems, Rheology, Multifase flows, Interfacial & colloidal phenomena, Transport phenomena in porous/granular media, Membranes and membrane science, Crystallization, distillation, absorption and extraction, Ionic liquids/electrolyte solutions.

Food Engineering :

Food science, Food engineering, Food microbiology, Food packaging, Food preservation, Food technology, Aseptic processing, Food fortification, Food rheology, Dietary supplement, Food safety, Food chemistry. AMA, Agricultural Mechanization in Asia, Africa and Latin America Teikyo Medical Journal Azerbaijan Medical Journal Gongcheng Kexue Yu Jishu/Advanced Engineering Science

Physics Section:

Astrophysics, Atomic and molecular physics, Biophysics, Chemical physics, Civil engineering, Cluster physics, Computational physics, Condensed matter, Cosmology, Device physics, Fluid dynamics, Geophysics, High energy particle physics, Laser, Mechanical engineering, Medical physics, Nanotechnology, Nonlinear science, Nuclear physics, Optics, Photonics, Plasma and fluid physics, Quantum physics, Robotics, Soft matter and polymers.

Mathematics Section:

Actuarial science, Algebra, Algebraic geometry, Analysis and advanced calculus, Approximation theory, Boundry layer theory, Calculus of variations, Combinatorics, Complex analysis, Continuum mechanics, Cryptography, Demography, Differential equations, Differential geometry, Dynamical systems, Econometrics, Fluid mechanics, Functional analysis, Game theory, General topology, Geometry, Graph theory, Group theory, Industrial mathematics, Information theory, Integral transforms and integral equations, Lie algebras, Logic, Magnetohydrodynamics, Mathematical analysis.

Latest Articles of

Technology Reports of Kansai University

Journal ID : TRKU-27-01-2021-11405
Total View : 423

Title : Electrochemical Preparation of Copper Oxide Nanoparticles for Dye-sensitized Solar Cells Application

Abstract :

In this study, copper oxide nanostructures were prepared by an easy, simple, short time and economical electrochemical method using polyvinyl pyrrolidone (PVP) and polyvinyl alcohol (PVA) as stabilizing agents. Copper is used as precursors as melt anode electrodes during electrolysis to prepare CuO particles. The characterization of the prepared CuO NPs was studied by field emission scanning (FE-SEM), transmission electron microscopy (TEM) and atomic force microscopy (AFM). The FE-SEM images of CuO / PVA and CuO / PVP were both rectangle and regular cube shapes respectively. TEM images were prepared from CuO / PVA and CuO / PVP. They had an average size of 30-50 nm. The XRD results revealed the hexagonal structure of CuO nanoparticles. The optical properties of the prepared CuO / PVA and CuO / PVP nanoparticles were studied through UV / VIS spectroscopy. The optical band gap was found to be 3.60 eV and 3.75 eV for CuO / PVP and CuO / PVA. Dye solar cells were designed using CuO / PVA and CuO / PVP as positive electrodes (front electrode) and graphite as cathode (back electrode) deposition on the surface of ITO glass in the presence of two types of natural dyes, these are cabbage and spinach dyes, and iodine / iodine electrolyte solution. The PV cells prepared using spinach dye were more efficient. It is noticed from the data that the dye has a very important role in increasing the efficiency of the solar cell, as the cells made from spinach gave a much higher efficiency than the cells prepared from the red cabbage dye in all cases.

Full article
Journal ID : TRKU-22-01-2021-11403
Total View : 344

Title : Design concerns in system architecture

Abstract :

Software design is described as the process of defining the architecture, components, interfaces, and other characteristics of a system or component plus the result of the process that births the design with an overall aim of creating the architecture on which the software will run. However, software designers are faced with numerous concerns during system design. This work discussed basic concerns namely security, modularity, performance and re-usability. Each of the issues were briefly and separately analysed to understand the intricacies. It was revealed that the use of models, understanding and predicting computers’ future, excellent system structuring control modeling, and modular decomposition are some of the solutions to the issues raised. Conclusively, since humans are still susceptible to errors and to adequately alleviate the impact of such during designs, designers and experts generally must understand high-level design concepts. The best architects don’t have to know how to implement all levels of design they only need an understanding of all the levels.

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