Technology Reports of Kansai University (ISSN: 04532198) is a monthly peer-reviewed and open-access international Journal. It was first built in 1959 and officially in 1975 till now by kansai university, japan. The journal covers all sort of engineering topic, mathematics and physics. Technology Reports of Kansai University (TRKU) was closed access journal until 2017. After that TRKU became open access journal. TRKU is a scopus indexed journal and directly run by faculty of engineering, kansai university.
Technology Reports of Kansai University (ISSN: 04532198) is a peer-reviewed journal. The journal covers all sort of engineering topic as well as mathematics and physics. the journal's scopes are
in the following fields but not limited to:
Kongzhi yu Juece/Control and Decision
Azerbaijan Medical Journal
Gongcheng Kexue Yu Jishu/Advanced Engineering Science
Zhonghua er bi yan hou tou jing wai ke za zhi = Chinese journal of otorhinolaryngology head and neck surgery
Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology
Wuhan Ligong Daxue Xuebao (Jiaotong Kexue Yu Gongcheng Ban)/Journal of Wuhan University of Technology (Transportation Science and Engineering)
Zhonghua yi shi za zhi (Beijing, China : 1980)
Changjiang Liuyu Ziyuan Yu Huanjing/Resources and Environment in the Yangtze Valley
Tobacco Science and Technology
Shenyang Jianzhu Daxue Xuebao (Ziran Kexue Ban)/Journal of Shenyang Jianzhu University (Natural Science)
General Medicine (ISSN:1311-1817)
Semiconductor including integrated circuit (IC) is an expensive and complicated process. The trend of semiconductor packaging is going towards better performance with lower power consumption packages. Thus, the single-die packaging trend has evolved into multi-die packaging. The evolution of multi- die packaging requires more tools and processing steps in the assembly process. Furthermore, any die is tested at Class, and detected faulty will cause the whole package to be scrapped. These factors cause a bigger loss in production yield to compare to the single-die packaging. A new framework is suggested for model training and evaluation for the application of machine learning in the semiconductor test. The proposed new framework will be able to provide a range of possible recall rates from minimum to maximum to identify which machine learning algorithms specifically
In small and medium-sized enterprises, the use of the information systems is now familiar. Information systems are widely used for different purposes, including the fulfillment of orders in a company. One system that can be used to fulfill orders in a small to medium business is Order Fulfillment Application. One small to medium business company in Jakarta has been using Order Fulfillment Application. A key process in chain management is the order fulfillment process. Supply is an order from customers that activates the supply chain, and it is the first step in providing customer service efficiently and effectively. Researchers are therefore interested in testing the software to assess application quality in the business. A field study and User Acceptance Test (UAT) with ISO 25010 standards are the tools used by researchers to run tests. Due to time and cost limitations, this work is restricted to functional suitability characteristics. Several inconsistencies between the expected results and real results have been identified from the test results, some of which have a significant level of severity. Although in its main functionality, the application used still meets the requirements of the company, it should be fixed as soon as possible. It is considered appropriate to use the UAT method because it can cover a wide range of functional suitability characteristics
